2025 International Conference on Materials Physics and Engineering Structures

VENUE

Shanghai · China

Submission Portal

Mail Address: icmpes@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;

  • 白老师
  • TEL:19522126617 (微信同号)
  • QQ:2784981077
  • E-mail:icmpes@sub-paper.com

Important Dates

Submission Deadline:2025-07-01
Registration Deadline:2025-07-08
Conference Date:2025-07-15
Notification Date:About a week after the submission

Indexing Service

Technical Sponsor