About to ICMPES 2025
In 2025, Shanghai will welcome an international event focusing on the latest developments in the fields of materials physics and engineering structures - the "International Conference on Materials Physics and Engineering Structures". The purpose of this conference is to provide a high-end communication platform for scientists, engineers, researchers, and industry experts worldwide to jointly explore cutting-edge issues in materials science and engineering structural design and their profound impact on future social development. As one of the technological innovation centers in China and even the world, Shanghai has excellent research facilities and a strong academic atmosphere, making it an ideal location for hosting this conference. The conference will conduct in-depth discussions on core themes such as the research and application of new materials, advanced material physical properties research, sustainable building materials, and intelligent engineering structural design. Top scholars and industry leaders from around the world will gather together to share their research findings and practical experiences through various forms such as keynote speeches, specialized seminars, roundtable forums, and poster displays. Specifically, this conference will also focus on interdisciplinary collaboration in the fields of materials physics and engineering structures, exploring how to use advanced materials and technologies to address challenges faced in modern engineering construction, such as improving building durability, optimizing energy efficiency, and enhancing natural disaster resistance. In addition, the conference will also establish a dedicated forum for young scientists to encourage and support the younger generation of researchers to showcase their innovative achievements, and promote communication between them and senior experts. The International Conference on Materials Physics and Engineering Structures is not only a place for knowledge sharing and technical exchange, but also an important platform for inspiring new ideas and establishing international cooperation networks. We sincerely invite all colleagues interested in materials physics and engineering structures to participate in this grand event, explore the infinite possibilities of technological development together, and work together to promote progress and development in this field. Let's gather in Shanghai and embark on a feast of ideas about materials science and engineering technology.
Record
All full paper submissions to the ICMPES 2025 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of ICMPES 2025 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
Submission Portal
Mail Address: icmpes@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;
- 白老师
- TEL：19522126617 (微信同号)
- QQ：2784981077
- E-mail：icmpes@sub-paper.com
Important Dates
Submission Deadline：2025-07-01
Registration Deadline：2025-07-08
Conference Date：2025-07-15
Notification Date：About a week after the submission
CALL FOR PAPERS
Material Physics: Physical Properties of Materials Material thermodynamics Material preparation technology Materials engineering atomic physics quantum mechanics Solid State Physics mechanical properties of materials Optoelectronic materials Microelectronics materials semiconductor superconductor Nanomaterials and Nanotechnology nanofabrication Material processing Engineering structure: Structural Wind Engineering structural monitoring Structural seismic resistance, vibration reduction, and vibration control Reliability and durability of the structure Structural load-bearing capacity Mechanical properties of engineering structures and materials Structural deformation and failure
..... View more themes>>About Plagiarism Check
Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.
Indexing Service
中文特别声明
出版社在论文出版前会对论文重复率进行检测，重复率大于20%的稿件将被拒绝出版；重复率不大于20%的稿件中，如有整段大面积的直接复制其他作者文章内容的情况，也会被拒绝出版。以上两种涉及抄袭的情况，一旦被出版社证实，文章将被拒绝出版，并且不退回任何会议注册费用。
Technical Sponsor
Submission Guidelines
Submit
Please submit the full text/abstract
of the paper to us through the elec
tronic submission system
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (icmpes@sub-paper.com) if you are interested in it.
SCI JOURNAL
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Submission Guidelines
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to icmpes@sub-paper.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.